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Journal Articles

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Jimil M. Shah, Keerthivasan Padmanaban, Hrishabh Singh, Surya Duraisamy Asokan, Satyam Saini, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021109.
Paper No: EP-21-1016
https://doi.org/10.1115/1.4052536
Published Online: October 14, 2021
View Article titled, Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling
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Topics: Cables, Cooling, Cycles, Fluids, Mineral oil, Printed circuit boards, Reliability, Temperature, Capacitance, Optical cables
Journal Articles

Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements

Ismail Turkmen, Cem Ahmet Mercan, Hamza Salih Erden
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031116.
Paper No: EP-20-1018
https://doi.org/10.1115/1.4047845
Published Online: August 5, 2020
View Article titled, Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements
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Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Temperature, Tiles, Potential energy, Stress, Leakage
Journal Articles

A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact

Santosh V. Angadi, Robert L. Jackson, Song-yul Choe, George T. Flowers, Bong-Yi Lee, Liang Zhong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011001.
https://doi.org/10.1115/1.4005955
Published Online: March 19, 2012
View Article titled, A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact
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Topics: Cables, Contact resistance, Finite element model, Heating, Surface roughness, Temperature, Joules, Current density, Stress, Flow (Dynamics)
Journal Articles

Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor

Shiva P. Gadag, Susan K. Patra, Volkan Ozguz, Phillipe Marchand, Sadik Esener
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 198–204.
https://doi.org/10.1115/1.1481894
Published Online: July 26, 2002
View Article titled, Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor
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Topics: Cables, Ceramics, Composite materials, Convection, Cooling, Design, Finite element analysis, Finite element model, Heat, Heat sinks
Journal Articles

0.4 μm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference Shielding

Xiaoping Shui, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 236–238.
https://doi.org/10.1115/1.2792242
Published Online: December 1, 1997
View Article titled, 0.4 μm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference Shielding
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Topics: Composite materials, Electromagnetic interference, Nickel, Silicones, Cables, Electrical resistivity, Gaskets
Journal Articles

Fluid Flow Modeling and Simulation for the Coaxial Cable of the LEASAT Antenna System

Hsien-Yang Yeh, Hen-Geul Yeh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1992, 114(3): 358–360.
https://doi.org/10.1115/1.2905464
Published Online: September 1, 1992
View Article titled, Fluid Flow Modeling and Simulation for the Coaxial Cable of the LEASAT Antenna System
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Topics: Cables, Fluid dynamics, Modeling, Simulation, Satellites, Pressure, Computer simulation, Fluid mechanics, Kinetic theory, Modeling analysis