Specific function or application in electronics often requires assembly of heterogeneous materials in a single system. Schemes to achieve such goals are of critical importance for applications ranging from the study in basic cell biology to multifunctional electronics for diagnostics/therapeutics. In this review article, we will first briefly introduce a few assembly techniques, such as microrobotic assembly, guided self-assembly, additive manufacturing, and transfer printing. Among various heterogeneous assembly techniques, transfer printing represents a simple yet versatile tool to integrate vastly different materials or structures in a single system. By utilizing such technique, traditionally challenging tasks have been enabled and they include novel experimental platforms for study of two-dimensional (2D) materials and cells, bio-integrated electronics such as stretchable and biodegradable devices, and three-dimensional (3D) assembly with advanced materials such as semiconductors.
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June 2017
Review Articles
Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration
Yuyan Gao,
Yuyan Gao
Department of Engineering Science
and Mechanics,
The Pennsylvania State University,
University Park, PA 16802
and Mechanics,
The Pennsylvania State University,
University Park, PA 16802
Search for other works by this author on:
Huanyu Cheng
Huanyu Cheng
Department of Engineering Science
and Mechanics,
The Pennsylvania State University,
University Park, PA 16802;
and Mechanics,
The Pennsylvania State University,
University Park, PA 16802;
Materials Research Institute,
The Pennsylvania State University,
University Park, PA 16802
e-mail: huanyu.cheng@psu.edu
The Pennsylvania State University,
University Park, PA 16802
e-mail: huanyu.cheng@psu.edu
Search for other works by this author on:
Yuyan Gao
Department of Engineering Science
and Mechanics,
The Pennsylvania State University,
University Park, PA 16802
and Mechanics,
The Pennsylvania State University,
University Park, PA 16802
Huanyu Cheng
Department of Engineering Science
and Mechanics,
The Pennsylvania State University,
University Park, PA 16802;
and Mechanics,
The Pennsylvania State University,
University Park, PA 16802;
Materials Research Institute,
The Pennsylvania State University,
University Park, PA 16802
e-mail: huanyu.cheng@psu.edu
The Pennsylvania State University,
University Park, PA 16802
e-mail: huanyu.cheng@psu.edu
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 1, 2016; final manuscript received February 22, 2017; published online June 13, 2017. Assoc. Editor: Xiaobing Luo.
J. Electron. Packag. Jun 2017, 139(2): 020801 (16 pages)
Published Online: June 13, 2017
Article history
Received:
December 1, 2016
Revised:
February 22, 2017
Citation
Gao, Y., and Cheng, H. (June 13, 2017). "Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration." ASME. J. Electron. Packag. June 2017; 139(2): 020801. https://doi.org/10.1115/1.4036238
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