After encapsulation, thermomechanical deformation builds up within the electronic packages due to the temperature coefficient of expansion mismatch between the respective materials within the package as it cools to room temperature. At the same time, the chemical cure shrinkage exerts important influence on the total deformation. Due to the complexity and time consuming of the calculation, it is almost impossible for an industry to carry out the numerical simulation using viscoelastic property, which is the most close to the real material property of polymer material. However, finite element analysis (FEA) using temperature-dependent elastic property, temperature-dependent thermal expansion coefficient, and accurate chemical cure shrinkage can help to improve the accuracy on the stress and warpage prediction. This study has developed an evaluation method for the chemical cure shrinkage based on the measurement of the warpage of bimaterial model. The results show that FEA simulations without chemical cure shrinkage fail to accurately predict the package warpage. On the other hand, FEA simulations with chemical cure shrinkage are outlined, which show fair agreement with experimental measurements of package warpage over a range of temperatures. Furthermore, this study has evaluated the effect of silica filler percentage on the chemical cure shrinkage and confirmed that the chemical cure shrinkage decreases with the increase in silica filler percentage.
Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis
Hu, G., Luan, J., and Chew, S. (February 13, 2009). "Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis." ASME. J. Electron. Packag. March 2009; 131(1): 011010. https://doi.org/10.1115/1.3068321
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