An accurate estimate of thermal stresses in multilayered microelectronics structures along the bonded interfaces is crucial for design and prediction of delamination-related failures. Compared with a numerical method, analytical closed-form solution can offer a more rapid method to obtain the stresses at the interfaces. An analytical model for ply-level sub-laminate analysis is investigated in this paper. The theory presented treats each layer as a beam-type plate with orthotropic material properties. As an example, the results are shown for a three-layer beam problem with special orthotropic material properties. Analytical model results are compared with the finite element analysis results, as a first order approximation.
Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD Division, January 28, 2002. Associate Editor: Y.-H. Pao.
Wen, Y., and Basaran, C. (March 14, 2003). "Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging ." ASME. J. Electron. Packag. March 2003; 125(1): 134–138. https://doi.org/10.1115/1.1535446
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