In this study, the effect of underfill on the level of stress concentrations is investigated and possible failure sites are identified by using a global/local finite element approach. The global elements capture the exact singular behavior of the stresses near the geometric and material discontinuities. Application of the strain energy density criterion indicates the possible failure sites and how they shift due to the presence of underfill.
Potential Failure Sites in a Flip-Chip Package With and Without Underfill
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Madenci, E., Shkarayev, S., and Mahajan, R. (December 1, 1998). "Potential Failure Sites in a Flip-Chip Package With and Without Underfill." ASME. J. Electron. Packag. December 1998; 120(4): 336–341. https://doi.org/10.1115/1.2792643
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