About the Journal
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Read more...
ASME Journal Media
Subscribe to our YouTube channel to see interviews with our Journal Editors discussing their research and vision for their journal. We also have a podcast series by Harry Dankowicz interviewing leading experts in a variety of Mechanical Engineering fields.
Call for Papers
ASME continuously publishes special issues in emerging areas. Stay up to date on the latest call for papers if you’d like to submit.
ASME’s Guide for Journal Authors
If you’re new to the ASME Journals, here’s our guide for submitting a paper, open access, benefits to authors and much more. Still have questions? We’re happy to hear from you! Send us an email at firstname.lastname@example.org.