Search Results | InterPACK | ASME Digital Collection

1-20 of 26

Sort by

Sort Order Select

Proceedings Papers

Design for Reliability of Automotive Chip Scale Packages by Calibrated Virtual Prototyping

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A015, October 26–28, 2021

Paper No: IPACK2021-73970

DOI: https://doi.org/10.1115/IPACK2021-73970

View Paper

Topics: Design, Finite element analysis, Reliability, Simulation, Thermomechanics

Proceedings Papers

Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys

Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 26–28, 2021

Paper No: IPACK2021-73548

DOI: https://doi.org/10.1115/IPACK2021-73548

View Paper

Topics: Alloys, Creep, Lead-free solders, Stress-strain curves, Temperature

Proceedings Papers

Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning

Pradeep Lall, Tony Thomas, Ken Blecker

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A019, October 26–28, 2021

Paper No: IPACK2021-74066

DOI: https://doi.org/10.1115/IPACK2021-74066

View Paper

Topics: Solders, Temperature, Vibration, Failure, Signals, Service life (Equipment), Time series, Complex systems, Dimensions, Maintenance

Proceedings Papers

Reliability of Electronic Drivers: An Industrial Approach

P. Watté, G. van Hees, R. Engelen, W. D. van Driel

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A005, October 26–28, 2021

Paper No: IPACK2021-72293

DOI: https://doi.org/10.1115/IPACK2021-72293

View Paper

Topics: Reliability

Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 26–28, 2021

Paper No: IPACK2021-69882

DOI: https://doi.org/10.1115/IPACK2021-69882

View Paper

Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress

Proceedings Papers

Reliability Evaluation of Cu-Al WB in High Temperature and High Current Applications

Pradeep Lall, Sungmo Jung

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A026, October 26–28, 2021

Paper No: IPACK2021-75890

DOI: https://doi.org/10.1115/IPACK2021-75890

View Paper

Topics: High temperature, Polarization (Electricity), Polarization (Light), Polarization (Waves), Reliability

Proceedings Papers

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer (RDL)

S. W. R. Lee, J. C. C. Lo, X. Qiu, N. Tu

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A025, October 26–28, 2021

Paper No: IPACK2021-74199

DOI: https://doi.org/10.1115/IPACK2021-74199

View Paper

Topics: Additive manufacturing, Reliability

Proceedings Papers

Evolution of Prony Parameters for Underfills Subjected to High Temperature Long Term Aging

Pradeep Lall, Yunli Zhang, Haotian Wu, Jeff Suhling, Edward Davis

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A024, October 26–28, 2021

Paper No: IPACK2021-74076

DOI: https://doi.org/10.1115/IPACK2021-74076

View Paper

Topics: High temperature, Reliability

Proceedings Papers

Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging

Pradeep Lall, Yunli Zhang, Haotian Wu, Jeff Suhling, Edward Davis, Jaimal Williamson

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A023, October 26–28, 2021

Paper No: IPACK2021-74075

DOI: https://doi.org/10.1115/IPACK2021-74075

View Paper

Topics: Epoxy adhesives, Epoxy resins, High temperature, Molding, Viscoelasticity

Proceedings Papers

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

Bart Vandevelde, Chinmay Nawghane, Riet Labie, Ralph Lauwaert, Daniel Werkhoven

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 26–28, 2021

Paper No: IPACK2021-73456

DOI: https://doi.org/10.1115/IPACK2021-73456

View Paper

Topics: Alloys, Fatigue, Melting point, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Contamination, Failure, Failure analysis

Proceedings Papers

Reliable Additive Manufacturing Using Transient Liquid Phase Sintering

Gilad Nave, Clifton Buxbaum, F. Patrick McCluskey

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 26–28, 2021

Paper No: IPACK2021-73367

DOI: https://doi.org/10.1115/IPACK2021-73367

View Paper

Topics: Additive manufacturing, Sintering, Tension-leg platforms, Transients (Dynamics)

Proceedings Papers

CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate

Tetsushi Fukuda, Yukio Masuda, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka, Katsuhiro Koizumi

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 26–28, 2021

Paper No: IPACK2021-72976

DOI: https://doi.org/10.1115/IPACK2021-72976

View Paper

Topics: Computational fluid dynamics, Cooling, Flow (Dynamics), Impellers, Density, Electronic equipment, Packaging, Fans, Flow visualization, Pressure

Proceedings Papers

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 26–28, 2021

Paper No: IPACK2021-72975

DOI: https://doi.org/10.1115/IPACK2021-72975

View Paper

Topics: Flow (Dynamics), Heat sinks, Modeling, Thermal resistance, Electronic equipment, Cooling, Design, Forced convection, Heat transfer, Network analysis

Proceedings Papers

Characterization of High-Density Aircraft Electronic and Thermal Management Systems

Joshua Kasitz, David Huitink

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A009, October 26–28, 2021

Paper No: IPACK2021-73287

DOI: https://doi.org/10.1115/IPACK2021-73287

View Paper

Topics: Aircraft, Aviation, Density, Reliability, Thermal management

Proceedings Papers

Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics

Beihan Zhao, Christopher Riso, David Leslie, Abhijit Dasgupta, Siddhartha Das, Jason Fleischer, Daniel Hines

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A008, October 26–28, 2021

Paper No: IPACK2021-73197

DOI: https://doi.org/10.1115/IPACK2021-73197

View Paper

Topics: Aerosols, Electronics, Finite element methods, Finite element model, Modeling, Printing, Silver, Temperature

Proceedings Papers

Mechanical Behavior of Heat Activated Film Adhesives

Prabhat Janamanchi, Abhijit Dasgupta, Narendra Singh

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 26–28, 2021

Paper No: IPACK2021-69719

DOI: https://doi.org/10.1115/IPACK2021-69719

View Paper

Topics: Adhesives, Heat, Mechanical behavior, Mechanical properties, Phase transitions

Proceedings Papers

Module-Level TIM Degradation in HALT

Joshua Tompkins, David Huitink

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 26–28, 2021

Paper No: IPACK2021-69511

DOI: https://doi.org/10.1115/IPACK2021-69511

View Paper

Topics: Aluminum, Cooling, Cycles, Electronics, Energy dissipation, Heating, Junctions, Life testing, Maintenance, Random vibration

Proceedings Papers

Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A022, October 26–28, 2021

Paper No: IPACK2021-74069

DOI: https://doi.org/10.1115/IPACK2021-74069

View Paper

Topics: Low temperature, Mechanical properties, Storage, Temperature, Alloys, Solders, Avionics, Climate, Design, Electronic packages

Proceedings Papers

Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A021, October 26–28, 2021

Paper No: IPACK2021-74068

DOI: https://doi.org/10.1115/IPACK2021-74068

View Paper

Topics: Alloys, High temperature, Low temperature materials, Solders, Storage

Proceedings Papers

Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 26–28, 2021

Paper No: IPACK2021-73348

DOI: https://doi.org/10.1115/IPACK2021-73348

View Paper

Topics: Intermetallic compounds, Lead-free solders, Solder joints, Alloys, Reliability, Copper, Elastic moduli, Electronic packaging, Nanoindentation, Polishing

NARROW

Design for Reliability of Automotive Chip Scale Packages by Calibrated Virtual Prototyping

Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys

Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning

Reliability of Electronic Drivers: An Industrial Approach

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Reliability Evaluation of Cu-Al WB in High Temperature and High Current Applications

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer (RDL)

Evolution of Prony Parameters for Underfills Subjected to High Temperature Long Term Aging

Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

Reliable Additive Manufacturing Using Transient Liquid Phase Sintering

CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Characterization of High-Density Aircraft Electronic and Thermal Management Systems

Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics

Mechanical Behavior of Heat Activated Film Adhesives

Module-Level TIM Degradation in HALT

Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage

Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only