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Microelectromechanical Systems (MEMS) and Nanoscale Phenomena in Electronics
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Proceedings Papers

Wafer Scale Encapsulation of MEMS Devices

Woo-Tae Park, Rob N. Candler, Huimou J. Li, Junghwa Cho, Holden Li, Thomas W. Kenny, Aaron Partridge, Gary Yama, Markus Lutz
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 209-212, July 6–11, 2003
Paper No: IPACK2003-35032
DOI: https://doi.org/10.1115/IPACK2003-35032
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Topics: Microelectromechanical systems, Semiconductor wafers, Packaging, Silicon, Electronics, MEMS packaging, Sealing (Process), Wire bonding
Proceedings Papers

Design of Micro-Arrayed Thin Film Thermocouples (TFTC)

Jong-Jin Park, Minoru Taya
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 213-217, July 6–11, 2003
Paper No: IPACK2003-35040
DOI: https://doi.org/10.1115/IPACK2003-35040
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Topics: Design, Thermocouples, Thin films, Copper, Aluminum, Bulk solids, Semiconductor wafers, Simulation, Heat conduction, Junctions
Proceedings Papers

Temperature Measurement by Using Metal Thin Film Thermocouples

Koji Miyazaki, Hiroshi Tsukamoto, Takahiro Miike, Toshiaki Takamiya
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 219-223, July 6–11, 2003
Paper No: IPACK2003-35042
DOI: https://doi.org/10.1115/IPACK2003-35042
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Topics: Metals, Temperature measurement, Thermocouples, Thin films, Electrons, Glass, Junctions, Diffusion (Physics), Dimensions, Film thickness
Proceedings Papers

Analysis and Validation of Sensing Sensitivity of a Piezoresistive Pressure Sensor

Chun-Te Lin, Chih-Tang Peng, Ji-Cheng Lin, Kuo-Ning Chiang
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 225-231, July 6–11, 2003
Paper No: IPACK2003-35053
DOI: https://doi.org/10.1115/IPACK2003-35053
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Topics: Finite element methods, Pressure sensors
Proceedings Papers

A Research of Actuators for Micromirror Control

Hiroki Mamiya, Koji Ishikawa, Qiang Yu
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 233-238, July 6–11, 2003
Paper No: IPACK2003-35123
DOI: https://doi.org/10.1115/IPACK2003-35123
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Topics: Actuators, Response surface methodology
Proceedings Papers

8CH AWG Multi/Demultiplexer With MEMS Variable Optical Attenuator

K. Ishikawa, Q. Yu
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 239-244, July 6–11, 2003
Paper No: IPACK2003-35145
DOI: https://doi.org/10.1115/IPACK2003-35145
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Topics: Microelectromechanical systems
Proceedings Papers

High-Density Through-Wafer Electrical Interconnects in Pyrex Substrate Integrated With Micromirror Array

C. C. Wang, T. D. Kudrle, M. Bancu, J. Hsiao, C. H. Mastrangelo
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 245-249, July 6–11, 2003
Paper No: IPACK2003-35203
DOI: https://doi.org/10.1115/IPACK2003-35203
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Topics: Borosilicate glasses, Density, Semiconductor wafers, Bonding, Construction, Flip-chip, Machining, Metals, Particle spin, Rotation
Proceedings Papers

Calibration Systems and Techniques for Automated Microassembly

K. Tsui, A. Geisberger, M. Ellis, G. Skidmore
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 251-255, July 6–11, 2003
Paper No: IPACK2003-35208
DOI: https://doi.org/10.1115/IPACK2003-35208
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Topics: Calibration, Microassembling, Manufacturing, Crystals, End effectors, Geometry, Microelectromechanical systems, Nickel, Robotics, Silicon
Proceedings Papers

Sub-Continuum Heat Conduction in Electronics Using the Lattice Boltzmann Method

Sartaj S. Ghai, Rodrigo A. Escobar, Myung S. Jhon, Cristina H. Amon
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 257-264, July 6–11, 2003
Paper No: IPACK2003-35258
DOI: https://doi.org/10.1115/IPACK2003-35258
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Topics: Electronics, Heat conduction, Lattice Boltzmann methods, Dimensions, Heat, Heat transfer, Silicon-on-insulator
Proceedings Papers

MEMS Mirror Switch for Multi-Channel Spectrophotometer

Adisorn Tuantranont, Tanom Lomas, V. M. Bright
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 265-268, July 6–11, 2003
Paper No: IPACK2003-35329
DOI: https://doi.org/10.1115/IPACK2003-35329
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Topics: Microelectromechanical systems, Mirrors, Reflectometers, Switches, Torsion, Design, Fibers, Manufacturing, Micromachining, Optical fiber
Proceedings Papers

Micromirror With Multiple Digitized Angles for Free Space Optical Crossconnects

Jianglong Zhang, Y. C. Lee
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 269-277, July 6–11, 2003
Paper No: IPACK2003-35341
DOI: https://doi.org/10.1115/IPACK2003-35341
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Topics: Microelectromechanical systems, Vacuum, Bending (Stress), Electrodes, Boundary element methods, Design, Electronics, Energy consumption, Finite element methods, Finite element model