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Proceedings Papers

Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Andy Clark, Xuemei Cheng, Lu An, Ezra Lee, Xiaosong Liu, Gang Feng
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 26–28, 2021
Paper No: IPACK2021-66842
DOI: https://doi.org/10.1115/IPACK2021-66842
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Topics: Electrical conductance, Thermoreflectance, Transducers, Thermal resistance, Architecture, Computer simulation, Electronic packaging, Fittings, Flow (Dynamics), Geometry
Proceedings Papers

Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces

Jingjing Shi, Anusha Krishnan, A. F. M. Anhar Uddin Bhuiyan, Yee Rui Koh, Kenny Huynh, Akhil Mauze, Sai Mu, Brian M. Foley, Habib Ahmad, Takeki Itoh, Yuewei Zhang, Chao Yuan, Samuel Kim, W. Alan Doolittle, Chris Van de Walle, James S. Speck, Mark Goorsky, Patrick Hopkins, Hongping Zhao, Samuel Graham
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 26–28, 2021
Paper No: IPACK2021-74116
DOI: https://doi.org/10.1115/IPACK2021-74116
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Topics: Alloys, Aluminum, Cathode rays, Chemical reactions, Cooling, Electrical conductance, Electron beams, Electronics, Energy dissipation, Gallium
Proceedings Papers

Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures

Sami Alajlouni, Kerry Maize, Peter Bermel, Ali Shakouri
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 7–9, 2019
Paper No: IPACK2019-6413
DOI: https://doi.org/10.1115/IPACK2019-6413
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Topics: Aluminum, Electrodiffusion, Imaging, Temperature, Thermoreflectance, Failure, Design, Resolution (Optics), Temperature profiles, Wire
Proceedings Papers

Integrated Optical Probing of the Thermal Dynamics of Wide Bandgap Power Electronics

James Spencer Lundh, Yiwen Song, Bikram Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Hyungtak Kim, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A014, October 7–9, 2019
Paper No: IPACK2019-6440
DOI: https://doi.org/10.1115/IPACK2019-6440
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Topics: Dynamics (Mechanics), Electron mobility, Electronics, Energy gap, Gallium nitride, Heating, Imaging, Temperature measurement, Thermoreflectance, Transistors
Proceedings Papers

Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management

Luke Yates, Ramez Cheaito, Aditya Sood, Zhe Cheng, Thomas Bougher, Mehdi Asheghi, Kenneth Goodson, Mark Goorsky, Firooz Faili, Dan Twitchen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 29–September 1, 2017
Paper No: IPACK2017-74163
DOI: https://doi.org/10.1115/IPACK2017-74163
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Topics: Electronics, Synthetic diamonds, Thermal conductivity, Thermal management, Diamonds, Chemical vapor deposition, Electron backscatter diffraction, Lasers, Boron, Heat flux
Proceedings Papers

Thermo-Mechanical Study of AlN Thin-Films As Heat Spreaders in III-V Photonic Devices

Shenghui Lei, Ertugrul Kardemir, David McCloskey, John F. Donegan, Ryan Enright
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, August 29–September 1, 2017
Paper No: IPACK2017-74184
DOI: https://doi.org/10.1115/IPACK2017-74184
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Topics: Flat heat pipes, Photonic equipment, Thermomechanics, Thin films, Stress, Waveguides, Cladding systems (Building), Design, Failure, Polymers
Proceedings Papers

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Georges Pavlidis, James Dallas, Sukwon Choi, Shyh-Chiang Shen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A011, August 29–September 1, 2017
Paper No: IPACK2017-74149
DOI: https://doi.org/10.1115/IPACK2017-74149
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Topics: Gallium nitride, Steady state, Thermal characterization, Transients (Dynamics), Temperature, Sapphire, Temperature distribution, Heating, Imaging, Joules
Proceedings Papers

Thermal Boundary Conductance at Metal-Graphene-Metal Interfaces Using Time-Domain Thermoreflectance Method

David B. Brown, Thomas L. Bougher, Baratunde A. Cola, Satish Kumar
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A004, July 6–9, 2015
Paper No: IPACK2015-48444
DOI: https://doi.org/10.1115/IPACK2015-48444
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Topics: Electrical conductance, Graphene, Metals, Thermoreflectance, Chemical vapor deposition, Copper foil
Proceedings Papers

Characterization of Carbon Nanotube Forest Interfaces Using Time Domain Thermoreflectance

Thomas L. Bougher, John H. Taphouse, Baratunde A. Cola
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A005, July 6–9, 2015
Paper No: IPACK2015-48587
DOI: https://doi.org/10.1115/IPACK2015-48587
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Topics: Carbon nanotubes, Thermoreflectance, Contact resistance, Heat transfer, Heating, Mechanical properties, Metrology, Probes, Thermal conductivity, Uncertainty
Proceedings Papers

Numerical Calculation of the Pulse Compression of Ultrashort Pulse Laser Light by Means of the Thermoreflectance of SiC Substrate

Hong Duc Doan, Kazuyoshi Fushinobu
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A007, July 16–18, 2013
Paper No: IPACK2013-73050
DOI: https://doi.org/10.1115/IPACK2013-73050
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Topics: Compression, Lasers, Thermoreflectance, Electrons, Temperature, Computer simulation, Density, Reflectance, Thermal analysis
Proceedings Papers

A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance

Kazuaki Yazawa, Dustin Kendig, James Christofferson, Ali Shakouri
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A023, July 16–18, 2013
Paper No: IPACK2013-73104
DOI: https://doi.org/10.1115/IPACK2013-73104
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Topics: Electron emission, Failure analysis, Imaging, Thermoreflectance, Circuits, Emissions, Failure, Electrons, Silicon, Temperature
Proceedings Papers

Analysing Transient Thermoreflectance Data Using Network Identification by Deconvolution

Y. Ezzahri, A. Shakouri
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 453-462, July 19–23, 2009
Paper No: InterPACK2009-89200
DOI: https://doi.org/10.1115/InterPACK2009-89200
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Topics: Thermoreflectance, Transients (Dynamics), Excitation, Heat, Heating, Lasers, Systems analysis, Heat conduction, Heat flux, Probes
Proceedings Papers

Thermal Characterization of a Single MOSFET Transistor at Cryogenic Temperatures

Xi Wang, Ali Shakouri
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 293-296, July 19–23, 2009
Paper No: InterPACK2009-89084
DOI: https://doi.org/10.1115/InterPACK2009-89084
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Topics: MOSFET transistors, Temperature, Thermal characterization, Temperature distribution, Gates (Closures), Design, Electrons, Flow (Dynamics), Heat, Phonons
Proceedings Papers

Micro-Raman Thermometry of Laser Heated Surfaces

Justin R. Serrano, Leslie M. Phinney
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 327-333, July 8–12, 2007
Paper No: IPACK2007-33571
DOI: https://doi.org/10.1115/IPACK2007-33571
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Topics: Lasers, Temperature measurement, Temperature, Polysilicon, Computer simulation, Data collection, Heating, Infrared imaging, Microelectromechanical systems, Microscopy
Proceedings Papers

Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning

Pavel L. Komarov, Mihai G. Burzo, Peter E. Raad
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1413-1420, July 17–22, 2005
Paper No: IPACK2005-73196
DOI: https://doi.org/10.1115/IPACK2005-73196
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Topics: Microelectronic devices, Temperature, Thermal characterization, Thermoreflectance, Reflectance, Silicon, Transients (Dynamics), MOSFET transistors, Resolution (Optics), Calibration
Proceedings Papers

Temperature Measurement by Using Metal Thin Film Thermocouples

Koji Miyazaki, Hiroshi Tsukamoto, Takahiro Miike, Toshiaki Takamiya
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 219-223, July 6–11, 2003
Paper No: IPACK2003-35042
DOI: https://doi.org/10.1115/IPACK2003-35042
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Topics: Metals, Temperature measurement, Thermocouples, Thin films, Electrons, Glass, Junctions, Diffusion (Physics), Dimensions, Film thickness