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Proceedings Papers

Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers

Raffaele L. Amalfi, Cong H. Hoang, Ryan Enright, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 26–28, 2021
Paper No: IPACK2021-72612
DOI: https://doi.org/10.1115/IPACK2021-72612
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Topics: Cooling systems, Cooling, Heat, Heat flux, Computer cooling, Containment systems, Coolants, Copper, Density, Design
Proceedings Papers

Fundamental Investigation of Effects of Surrounding Conditions on Measurement Uncertainty in Temperature of Surface-Mounted Components by Thermocouples

Takashi Fukue, Koichi Hirasawa
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 26–28, 2021
Paper No: IPACK2021-69101
DOI: https://doi.org/10.1115/IPACK2021-69101
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Topics: Measurement uncertainty, Temperature, Thermocouples, Temperature measurement, Electrical components, Evaluation methods, Heat, Heat transfer, Uncertainty
Proceedings Papers

Integrated Optical Probing of the Thermal Dynamics of Wide Bandgap Power Electronics

James Spencer Lundh, Yiwen Song, Bikram Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Hyungtak Kim, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A014, October 7–9, 2019
Paper No: IPACK2019-6440
DOI: https://doi.org/10.1115/IPACK2019-6440
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Topics: Dynamics (Mechanics), Electron mobility, Electronics, Energy gap, Gallium nitride, Heating, Imaging, Temperature measurement, Thermoreflectance, Transistors
Proceedings Papers

Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature

Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Joon Seop Kwak, Jaehee Cho, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 7–9, 2019
Paper No: IPACK2019-6426
DOI: https://doi.org/10.1115/IPACK2019-6426
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Topics: Gallium nitride, Heating, Junctions, Light-emitting diodes, Temperature, Brightness (Photometry), Indium gallium nitride, Nanoparticles, Quantum wells, Temperature measurement
Proceedings Papers

Analysis of Thermal Properties of Power Multifinger HEMT Devices

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Luboš Černaj, Patrik Príbytný, Daniel Donoval, Jaroslav Kováč, Sylvain Laurent Delage, Jean-Claude Jacquet
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 27–30, 2018
Paper No: IPACK2018-8256
DOI: https://doi.org/10.1115/IPACK2018-8256
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Topics: Cooling, Design, Electrons, Gallium nitride, Heat, Manufacturing, Mechanical admittance, Optimization, Packaging, Raman spectroscopy
Proceedings Papers

Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe

Pawan Singh Kathait, Rajnish N. Sharma
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A023, August 29–September 1, 2017
Paper No: IPACK2017-74119
DOI: https://doi.org/10.1115/IPACK2017-74119
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Topics: Heat pipes, Computer cooling, Heat, Oscillations, Vapors, Bubbles, Construction, Design, Flux (Metallurgy), Heat transfer
Proceedings Papers

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Georges Pavlidis, James Dallas, Sukwon Choi, Shyh-Chiang Shen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A011, August 29–September 1, 2017
Paper No: IPACK2017-74149
DOI: https://doi.org/10.1115/IPACK2017-74149
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Topics: Gallium nitride, Steady state, Thermal characterization, Transients (Dynamics), Temperature, Sapphire, Temperature distribution, Heating, Imaging, Joules
Proceedings Papers

Temperature Depression Under Heat Sources With Cylindrical Contact Thermocouples

Kayvan Abbasi, Sukhvinder Kang
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A006, July 6–9, 2015
Paper No: IPACK2015-48641
DOI: https://doi.org/10.1115/IPACK2015-48641
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Topics: Heat, Temperature, Thermocouples, Heat sinks, Temperature distribution, Approximation, Errors, Heat conduction, Heat transfer coefficients, Springs
Proceedings Papers

Thermodynamic Characterization of a Direct Water Cooled Server Rack Running Synthetic and Real High Performance Computing Work Loads

Lynn Parnell, Garrison Vaughan, John Thompson, Daniel Duffy, Louis Capps, Mark E. Steinke, Vinod Kamath
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A031, July 6–9, 2015
Paper No: IPACK2015-48470
DOI: https://doi.org/10.1115/IPACK2015-48470
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Topics: Server racks, Stress, Water, Cooling, Flow (Dynamics), Temperature, Computers, Coolants, Density, Design
Proceedings Papers

Non-Intrusive Case Temperature Measurement Method of Direct-Water-Cooled Power Module

Keisuke Horiuchi, Yuichiro Konishi, Atsuo Nishihara
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A013, July 6–9, 2015
Paper No: IPACK2015-48625
DOI: https://doi.org/10.1115/IPACK2015-48625
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Topics: Temperature measurement, Water, Flow (Dynamics), Thermal resistance, Capacitance, Computer simulation, Design, Heat, Heat transfer, Junctions
Proceedings Papers

Measured-Temperature Interpolation and Visualization for Data Centers

Xuanhang (Simon) Zhang, Christopher M. Healey, Zachary R. Sheffer, James W. VanGilder
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A006, July 16–18, 2013
Paper No: IPACK2013-73081
DOI: https://doi.org/10.1115/IPACK2013-73081
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Topics: Data centers, Interpolation, Temperature, Visualization, Cooling, Temperature sensors, Computation, Computational fluid dynamics, Fluid dynamics, Maintenance
Proceedings Papers

Transient Thermal Response of Servers Through Air Temperature Measurements

Hamza Salih Erden, H. Ezzat Khalifa, Roger R. Schmidt
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A023, July 16–18, 2013
Paper No: IPACK2013-73281
DOI: https://doi.org/10.1115/IPACK2013-73281
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Topics: Temperature measurement, Transients (Dynamics), Capacitance, Temperature, Computational fluid dynamics, Data centers, Thermal conductivity
Proceedings Papers

Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory

Sami A. Alkharabsheh, Bharathkrishnan Muralidharan, Mahmoud Ibrahim, Saurabh K. Shrivastava, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A018, July 16–18, 2013
Paper No: IPACK2013-73214
DOI: https://doi.org/10.1115/IPACK2013-73214
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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Leakage, Containment, Errors, Calibration, Containment systems, Flow measurement
Proceedings Papers

Dependence of Flow Boiling Heat Transfer Coefficient on Location and Vapor Quality in a Microchannel Heat Sink

Ravi S. Patel, Tannaz Harirchian, Suresh V. Garimella
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 143-151, July 6–8, 2011
Paper No: IPACK2011-52089
DOI: https://doi.org/10.1115/IPACK2011-52089
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Topics: Boiling, Flow (Dynamics), Heat sinks, Heat transfer coefficients, Microchannels, Vapors, Dimensions, Dielectric liquids, Energy dissipation, Entrance region
Proceedings Papers

Microscale Temperature Measurements Near the Contact Line of an Evaporating Thin Film in a V-Groove

C. P. Migliaccio, H. K. Dhavaleswarapu, S. V. Garimella
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 363-370, July 19–23, 2009
Paper No: InterPACK2009-89134
DOI: https://doi.org/10.1115/InterPACK2009-89134
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Topics: Evaporation, Microscale devices, Temperature measurement, Thin films, Quartz, Shapes, Geometry, Heat, Heat flux, Heat transfer
Proceedings Papers

Transient Thermal Characterization of ErAs/In 0.53 Ga 0.47 As Thermoelectric Module

Y. Ezzahri, R. Singh, K. Fukutani, Z. Bian, A. Shakouri, G. Zeng, J. E. Bowers, J. M. Zide, A. C. Gossard
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 277-281, July 8–12, 2007
Paper No: IPACK2007-33880
DOI: https://doi.org/10.1115/IPACK2007-33880
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Topics: Thermal characterization, Transients (Dynamics), Electrons, Nanoparticles, Semiconductors (Materials), Crystals, Electromagnetic scattering, Heat, Heat transfer, Metals
Proceedings Papers

Micro-Raman Thermometry of Laser Heated Surfaces

Justin R. Serrano, Leslie M. Phinney
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 327-333, July 8–12, 2007
Paper No: IPACK2007-33571
DOI: https://doi.org/10.1115/IPACK2007-33571
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Topics: Lasers, Temperature measurement, Temperature, Polysilicon, Computer simulation, Data collection, Heating, Infrared imaging, Microelectromechanical systems, Microscopy
Proceedings Papers

Comparison of Experimental Temperature Results With Numerical Modeling Predictions of a Real-World Compact Data Center Facility

Yasuo Amemiya, Madhusudan Iyengar, Hendrik Hamann, Martin O’Boyle, Michael Schappert, Jing Shen, Theodore van Kessel
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 871-876, July 8–12, 2007
Paper No: IPACK2007-33899
DOI: https://doi.org/10.1115/IPACK2007-33899
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Topics: Computer simulation, Data centers, Temperature, Computational fluid dynamics, Transients (Dynamics), Air conditioning, Temperature profiles, Algorithms, Boundary-value problems, Energy dissipation
Proceedings Papers

Thermometry of Polycrystalline Silicon Structures Using Raman Spectroscopy

Mark R. Abel, Samuel Graham
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1695-1702, July 17–22, 2005
Paper No: IPACK2005-73088
DOI: https://doi.org/10.1115/IPACK2005-73088
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Topics: Microelectromechanical systems, Polysilicon, Raman spectroscopy, Temperature measurement, Thermal stresses
Proceedings Papers

Impingement Air Cooling With Synthetic Jets Over Small and Large Heated Surfaces

Jivtesh Garg, Mehmet Arik, Stanton Weaver
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 277-285, July 17–22, 2005
Paper No: IPACK2005-73211
DOI: https://doi.org/10.1115/IPACK2005-73211
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Topics: Cooling, Jets, Heat transfer, Natural convection, Electronics, Energy consumption, Heat, Heat transfer coefficients, Imaging, Resonance