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Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019
Paper No: IPACK2019-6408
DOI: https://doi.org/10.1115/IPACK2019-6408
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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability
Proceedings Papers

Analysis of Thermal Properties of Power Multifinger HEMT Devices

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Luboš Černaj, Patrik Príbytný, Daniel Donoval, Jaroslav Kováč, Sylvain Laurent Delage, Jean-Claude Jacquet
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 27–30, 2018
Paper No: IPACK2018-8256
DOI: https://doi.org/10.1115/IPACK2018-8256
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Topics: Cooling, Design, Electrons, Gallium nitride, Heat, Manufacturing, Mechanical admittance, Optimization, Packaging, Raman spectroscopy
Proceedings Papers

Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO 2 Passivation

Dogacan Kara, F. Nazli Donmezer Akgun
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A011, August 29–September 1, 2017
Paper No: IPACK2017-74125
DOI: https://doi.org/10.1115/IPACK2017-74125
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Topics: Gallium nitride, Plates (structures), Collapse, Electrons, Heating, Reliability, Electric fields, Electron mobility, Engineering simulation, Joules
Proceedings Papers

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 29–September 1, 2017
Paper No: IPACK2017-74059
DOI: https://doi.org/10.1115/IPACK2017-74059
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Topics: Current density, Damage, Electrodiffusion, Metals, Evaluation methods, Atoms, Circuit design, Computer simulation, Density, Electrons
Proceedings Papers

Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints

Md Hasnine, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A008, July 6–9, 2015
Paper No: IPACK2015-48623
DOI: https://doi.org/10.1115/IPACK2015-48623
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Topics: Silver, Solder joints, Creep, Alloys, Solders, Nanoindentation, Testing, Crystal structure, Crystals, Stress
Proceedings Papers

Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT

Hyoungsoon Lee, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A018, July 6–9, 2015
Paper No: IPACK2015-48670
DOI: https://doi.org/10.1115/IPACK2015-48670
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Topics: Computer simulation, Gallium nitride, Heat flux, Microcoolers, Microchannels, Simulation, Computational fluid dynamics, Flow (Dynamics), Fluids, Heat conduction
Proceedings Papers

Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A003, July 16–18, 2013
Paper No: IPACK2013-73130
DOI: https://doi.org/10.1115/IPACK2013-73130
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Topics: Carbon nanotubes, Current density, Damage, Oxidation, Oxygen, Atoms, Carbon, Density, Electrodes, Electrodiffusion
Proceedings Papers

Heat Transfer in Nanoelectronics by Quantum Mechanics

Thomas Prevenslik
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A011, July 16–18, 2013
Paper No: IPACK2013-73173
DOI: https://doi.org/10.1115/IPACK2013-73173
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Topics: Heat transfer, Nanoelectronics, Quantum mechanics, Heat, Joules, Quantum electrodynamics, Circuits, Phonons, Radiation (Physics), Temperature
Proceedings Papers

Reliability of Bonded Interfaces for Automotive Power Electronics

Douglas DeVoto, Paul Paret, Sreekant Narumanchi, Mark Mihalic
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A004, July 16–18, 2013
Paper No: IPACK2013-73143
DOI: https://doi.org/10.1115/IPACK2013-73143
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Topics: Electronics, Reliability, Cycles, Acoustics, Adhesives, Carbon fibers, Silver, Thermal resistance, Copper, Damage
Proceedings Papers

Effect of the Lattice Mismatch Between Copper Thin-Film Interconnection and Base Material on the Crystallinity of the Interconnection

Chuanhong Fan, Ryosuke Furuya, Osamu Asai, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A005, July 16–18, 2013
Paper No: IPACK2013-73147
DOI: https://doi.org/10.1115/IPACK2013-73147
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Topics: Copper, Thin films, Design, Diffraction, Electron backscatter diffraction, Electrons, Ruthenium, Semiconductor devices
Proceedings Papers

Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density

Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A013, July 16–18, 2013
Paper No: IPACK2013-73248
DOI: https://doi.org/10.1115/IPACK2013-73248
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Topics: Density, Simulation, Stress, Diffusion (Physics), Computer simulation, Electron mobility, Electrons, Heat conduction, Momentum, MOSFET transistors
Proceedings Papers

Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis

Risako Kibushi, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A049, July 16–18, 2013
Paper No: IPACK2013-73273
DOI: https://doi.org/10.1115/IPACK2013-73273
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Topics: Heat, MOSFET transistors, Electrons, Temperature, Thermal energy, Thermal properties, Crystal lattices, Density, Electric fields, Electronics
Proceedings Papers

Numerical Calculation of the Pulse Compression of Ultrashort Pulse Laser Light by Means of the Thermoreflectance of SiC Substrate

Hong Duc Doan, Kazuyoshi Fushinobu
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A007, July 16–18, 2013
Paper No: IPACK2013-73050
DOI: https://doi.org/10.1115/IPACK2013-73050
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Topics: Compression, Lasers, Thermoreflectance, Electrons, Temperature, Computer simulation, Density, Reflectance, Thermal analysis
Proceedings Papers

A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance

Kazuaki Yazawa, Dustin Kendig, James Christofferson, Ali Shakouri
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A023, July 16–18, 2013
Paper No: IPACK2013-73104
DOI: https://doi.org/10.1115/IPACK2013-73104
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Topics: Electron emission, Failure analysis, Imaging, Thermoreflectance, Circuits, Emissions, Failure, Electrons, Silicon, Temperature
Proceedings Papers

Electromigration in Copper-Core Solder Ball Joints During Thermal Cycle Tests

Shinichi Fujiwara, Nobuhiko Chiwata, Masaru Fujiyoshi, Motoki Wakano, Hisashi Tanie
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 719-723, July 6–8, 2011
Paper No: IPACK2011-52110
DOI: https://doi.org/10.1115/IPACK2011-52110
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Topics: Copper, Cycles, Electrodiffusion, Solders, Intermetallic compounds, Solder joints, Current density, Joining, Reliability, Accelerated life testing
Proceedings Papers

Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes Under High Current Density

Kazuhiko Sasagawa, Jun Unuma, Takehiro Abo
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 487-491, July 6–8, 2011
Paper No: IPACK2011-52169
DOI: https://doi.org/10.1115/IPACK2011-52169
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Topics: Carbon nanotubes, Current density, Damage, Oxygen, Multi-walled carbon nanotubes, Oxidation, Carbon, Density, Electrodiffusion, Electrons
Proceedings Papers

Multi-Physics of Nanoscale Thin Films and Interfaces

M. A. Haque
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 375-379, July 6–8, 2011
Paper No: IPACK2011-52038
DOI: https://doi.org/10.1115/IPACK2011-52038
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Topics: Nanoscale phenomena, Physics, Thin films, Electrical conductivity, Thermal conductivity, Deformation, Design, Dimensions, Electron microscopes, Electrons
Proceedings Papers

Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin

Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 381-386, July 6–8, 2011
Paper No: IPACK2011-52062
DOI: https://doi.org/10.1115/IPACK2011-52062
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Topics: Carbon, Nanotubes, Resins, Sensors, Multi-walled carbon nanotubes, Carbon nanotubes, Electrical conductivity, Electrical resistance, Rubber, Single-walled carbon nanotubes
Proceedings Papers

Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors

Masaaki Koganemaru, Keisuke Yoshida, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 479-486, July 6–8, 2011
Paper No: IPACK2011-52150
DOI: https://doi.org/10.1115/IPACK2011-52150
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Topics: Metal oxide semiconductors, Stress, Transistors, Simulation, Electron mobility, Computer simulation, Diffusion (Physics), Electrons, Flow (Dynamics), Gates (Closures)
Proceedings Papers

Numerical Solutions of Poisson Equation by the CIP-Basis Set Method

Daisuke Shibata, Takayuki Utsumi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 91-98, July 19–23, 2009
Paper No: InterPACK2009-89150
DOI: https://doi.org/10.1115/InterPACK2009-89150
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Topics: Poisson equation, Waves, Polynomials, Computers, Crystals, Density, Eigenvalues, Electron configuration, Electrons, Errors