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Proceedings Papers

Direct Ink Printing of Cavities in DPC Ceramic Substrates With Kaolin Pastes for Hermetic Packaging

Qinglei Sun, Yang Peng, Hao Cheng, Yun Mou, Mingxiang Chen
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, October 7–9, 2019
Paper No: IPACK2019-6616
https://doi.org/10.1115/IPACK2019-6616
View Paper titled, Direct Ink Printing of Cavities in DPC Ceramic Substrates With Kaolin Pastes for Hermetic Packaging
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Topics: Cavities, Ceramics, Inks, Kaolin, Packaging, Printing, Rheology
Proceedings Papers

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Hao Huang, Qian Jiang, Abhijit Dasgupta, Ehsan Mirbagheri, Krishna Darbha
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 27–30, 2018
Paper No: IPACK2018-8345
https://doi.org/10.1115/IPACK2018-8345
View Paper titled, Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)
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Topics: Adhesives, Creep, Pressure, Stress, Bonding, Hydrostatics, Temperature, Cavitation, Cavities, Design
Proceedings Papers

Physics of Interfacial Heat Transfer Events in Flow Boiling of FC-72 Liquid in Microchannels

Sajjad Bigham, Saeed Moghaddam
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A017, July 6–9, 2015
Paper No: IPACK2015-48581
https://doi.org/10.1115/IPACK2015-48581
View Paper titled, Physics of Interfacial Heat Transfer Events in Flow Boiling of FC-72 Liquid in Microchannels
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Physics, Bubbles, Evaporation, Heat flux, Resolution (Optics), Thermal conductivity
Proceedings Papers

Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits

Arvind Sridhar, Chin Lee Ong, Stefan Paredes, Bruno Michel, Thomas Brunschwiler, Pritish Parida, Evan Colgan, Timothy Chainer, Catherine Gorle, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A039, July 6–9, 2015
Paper No: IPACK2015-48690
https://doi.org/10.1115/IPACK2015-48690
View Paper titled, Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits
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Topics: Cavities, Cooling, Design, Integrated circuits, Fluids, Pressure, Blocks (Building materials), Computer simulation, Construction, Drainage
Proceedings Papers

Reduced Order Modeling for Chip-Embedded Micro-Channel Flow Boiling

Pritish R. Parida
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A085, July 6–9, 2015
Paper No: IPACK2015-48370
https://doi.org/10.1115/IPACK2015-48370
View Paper titled, Reduced Order Modeling for Chip-Embedded Micro-Channel Flow Boiling
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Topics: Boiling, Microchannel flow, Modeling, Cooling, Cavities, Convection, Engineering simulation, Evaporative cooling, Fluids, Heat
Proceedings Papers

Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

Li-Anne Liew, Ching-Yi Lin, Alexander Yersak, Ryan Lewis, Collin Coolidge, Y. C. Lee
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A009, July 6–9, 2015
Paper No: IPACK2015-48814
https://doi.org/10.1115/IPACK2015-48814
View Paper titled, Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps
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Topics: Coatings, Nanoscale phenomena, Membranes, Semiconductor wafers, Valves, Compression, Diaphragms (Mechanical devices), Diaphragms (Structural), Microelectromechanical systems, Cavities
Proceedings Papers

CMUTs in Permanent Contact Operation for High Output Pressure

Min-Chieh Ho, Maik Hoffmann, Alexander Unger, Kwan Kyu Park, Mario Kupnik, Butrus T. Khuri-Yakub
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A012, July 6–9, 2015
Paper No: IPACK2015-48733
https://doi.org/10.1115/IPACK2015-48733
View Paper titled, CMUTs in Permanent Contact Operation for High Output Pressure
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Topics: Pressure, Transducers, Acoustics, Cavities, Ultrasonic transducers, Bonding, Cycles, Deflection, Displacement, High temperature
Proceedings Papers

Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems

Sevket Umut Yuruker, Mehmet Arik, Enes Tamdogan, Rustamjon Melikov, Sedat Nizamoglu, Daniel Aaron Press, Ilkem Durak
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A015, July 6–9, 2015
Paper No: IPACK2015-48326
https://doi.org/10.1115/IPACK2015-48326
View Paper titled, Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems
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Topics: Cavities, Proteins, Silicones, Biomaterials, Computational fluid dynamics, Light-emitting diodes, Phosphors, Polymers, Thermal conductivity, Absorption
Proceedings Papers

Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling

Pritish R. Parida, Hsin-Hua Tsuei, Timothy J. Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A027, July 6–9, 2015
Paper No: IPACK2015-48489
https://doi.org/10.1115/IPACK2015-48489
View Paper titled, Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling
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Topics: Boiling, Cavities, Coolants, Cooling, Density, Evaporative cooling, Flow (Dynamics), Fluids, Heat transfer, Integrated circuits
Proceedings Papers

Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging

Maaike M. V. Taklo, Astrid-Sofie Vardøy, Ingrid De Wolf, Veerle Simons, H. J. van de Wiel, Adri van der Waal, Adriana Lapadatu, Stian Martinsen, Bernhard Wunderle
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A007, July 16–18, 2013
Paper No: IPACK2013-73317
https://doi.org/10.1115/IPACK2013-73317
View Paper titled, Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging
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Topics: Packaging, Semiconductor wafers, Silicon, Stress, Tin, Vehicles, Bonding, Modeling, Transistors, Bolometers
Proceedings Papers

Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors

Shawn J. Cunningham, Yvonne Heng, Nabeel Idrisi, Brad Nelson, John McKillop
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A002, July 16–18, 2013
Paper No: IPACK2013-73222
https://doi.org/10.1115/IPACK2013-73222
View Paper titled, Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors
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Topics: Capacitors, Flip-chip, Flip-chip devices, Microelectromechanical systems, Packaging, Semiconductor wafers, Solders, Stress, Deflection, Failure
Proceedings Papers

On the Lateral Motion of Bubbles Generated From Re-Entrant Cavities Located on Asymmetrically Structured Surfaces

Naveenan Thiagarajan, Florian Kapsenberg, Vinod Narayanan, Sushil H. Bhavnani, Charles Ellis
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 123-131, July 6–8, 2011
Paper No: IPACK2011-52056
https://doi.org/10.1115/IPACK2011-52056
View Paper titled, On the Lateral Motion of Bubbles Generated From Re-Entrant Cavities Located on Asymmetrically Structured Surfaces
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Topics: Bubbles, Cavities, Nucleation (Physics), Etching, Flow (Dynamics), Heat sinks, Lithography, Photography, Pool boiling, Propulsion systems
Proceedings Papers

Power/Ground Pin-Map Design for Power Integrity

Jingook Kim, James Drewniak, Jun Fan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 675-679, July 6–8, 2011
Paper No: IPACK2011-52287
https://doi.org/10.1115/IPACK2011-52287
View Paper titled, Power/Ground Pin-Map Design for Power Integrity
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Topics: Design, Circuits, Cavities, Performance, Resonance
Proceedings Papers

Heat Balance of Micro Hot-Film Sensor Elements Under the Different Gas Operation

Hidetomo Nagayo, Shinji Honami, Shoji Kamiunten, Masahiro Motosuke
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 347-355, July 19–23, 2009
Paper No: InterPACK2009-89120
https://doi.org/10.1115/InterPACK2009-89120
View Paper titled, Heat Balance of Micro Hot-Film Sensor Elements Under the Different Gas Operation
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Topics: Heat, Sensors, Flow (Dynamics), Electricity (Physics), Simulation, Cavities, Fluids, Gas flow, Helium, Manufacturing
Proceedings Papers

Experimental Investigation of Flow Boiling in a Single, Surface-Augmented Silicon Microchannel

Naveenan Thiagarajan, Daniel T. Pate, Sushil H. Bhavnani, Rory J. Jones
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 553-562, July 19–23, 2009
Paper No: InterPACK2009-89324
https://doi.org/10.1115/InterPACK2009-89324
View Paper titled, Experimental Investigation of Flow Boiling in a Single, Surface-Augmented Silicon Microchannel
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Topics: Boiling, Flow (Dynamics), Microchannels, Silicon, Subcooling, Cavities, Flux (Metallurgy), Heat sinks, Pressure drop, Cooling
Proceedings Papers

Control of Instabilities in Two-Phase Microchannel Flow Using Artificial Nucleation Sites

Rory J. Jones, Daniel T. Pate, Sushil H. Bhavnani
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 347-358, July 8–12, 2007
Paper No: IPACK2007-33602
https://doi.org/10.1115/IPACK2007-33602
View Paper titled, Control of Instabilities in Two-Phase Microchannel Flow Using Artificial Nucleation Sites
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Topics: Microchannel flow, Nucleation (Physics), Flow (Dynamics), Microchannels, Heat, Subcooling, Cavities, Heat sinks, Bubbly flow, Electronics
Proceedings Papers

Mold Adhesion Force Measurement

Huei-Huang Lee, Sheng-Jye Hwang, Durn-Yuan Huang, Yeong-Jyh Lin
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 51-58, July 8–12, 2007
Paper No: IPACK2007-33826
https://doi.org/10.1115/IPACK2007-33826
View Paper titled, Mold Adhesion Force Measurement
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Topics: Adhesion, Force measurement, Coatings, Molding, Engineers, Instrumentation, Temperature, Foundry coatings, Surface finishing, Cavities
Proceedings Papers

Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages

Jason M. Brand, Salvatore A. Ruggero, Amip J. Shah
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 887-894, July 8–12, 2007
Paper No: IPACK2007-33044
https://doi.org/10.1115/IPACK2007-33044
View Paper titled, Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages
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Topics: Cavities, Compression, Deformation, Packaging, Vehicles
Proceedings Papers

High Resolution Die Stress Mapping Using Arrays of CMOS Sensors

Yonggang Chen, Richard C. Jaeger, Jeffrey C. Suhling
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 285-295, July 8–12, 2007
Paper No: IPACK2007-33569
https://doi.org/10.1115/IPACK2007-33569
View Paper titled, High Resolution Die Stress Mapping Using Arrays of CMOS Sensors
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Topics: Complementary metal oxide semiconductors, Resolution (Optics), Sensors, Stress, Integrated circuits, Calibration, Cavities, Finite element analysis, Mirrors, Shear stress
Proceedings Papers

Analytical Solution of Whispering-Gallery Modes

Haiyong Quan, Zhixiong Guo
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 489-497, July 8–12, 2007
Paper No: IPACK2007-33124
https://doi.org/10.1115/IPACK2007-33124
View Paper titled, Analytical Solution of Whispering-Gallery Modes
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Topics: Boundary-value problems, Cavities, Electric fields, Filters, Microelectromechanical systems, Nanoelectromechanical systems, Nanosensors, Resonance, Separation (Technology), Wave equations