Topics: Flow (Dynamics), Heat flux, Heat transfer, Inflow, Natural convection, Outflow, Rayleigh number, Wall temperature

Topics: Design, Printed circuit boards, Air flow, Heat, Dimensions, Electronic components, Energy dissipation, Engineers, Temperature, Temperature distribution

Topics: Composite materials, Heat conduction, Inverse problems, Heat flux, Temperature, Aerospace industry, Aircraft, Boundary-value problems, Computation, Cooling

Topics: Lasers, Microscopes, Thin films, Laser beams, Thermal diffusivity, Thermocouples, Waves, Bulk solids, Fittings, Glass

Topics: Cooling, Electronic packages, Heat sinks, Temperature, Aluminum, Computer cooling, Heat, Heat transfer, Porosity, Reynolds number

Topics: Heat transfer, Microchannels, Pressure drop, Silicon, Flow (Dynamics), Theoretical analysis, Chemical etching, Fluids, Forced convection, Reynolds number

Topics: Cross-flow, Heat, Printed circuit boards, Computer simulation, Flow (Dynamics), Fluids, Boundary layers, Convection, Forced convection, Heat conduction

Topics: Composite materials, Heat transfer, Carbon reinforced plastics, Resolution (Optics), Atomic force microscopy, Microscale devices, Pressure, Temperature, Visualization, Atmospheric pressure