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Proceedings Papers

Potentials and Limitations of Concentrator Silicon Solar Cells Energy Utilization

Mohamed M. Elsabahy, Mohamed Emam, Hidetoshi Sekiguchi, Mahmoud Ahmed

Proc. ASME. IMECE2022, Volume 6: Energy, V006T08A056, October 30–November 3, 2022

Paper No: IMECE2022-95678

DOI: https://doi.org/10.1115/IMECE2022-95678

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Topics: Heat sinks, Silicon, Solar cells

Proceedings Papers

A Computationally Efficient Approach for the Simulation of Silicon Anodes in Lithium-Ion Cells

Rebecca Webb, Xiaoling Chen, Sandip Mazumder, Marcello Canova

Proc. ASME. IMECE2022, Volume 6: Energy, V006T08A006, October 30–November 3, 2022

Paper No: IMECE2022-96150

DOI: https://doi.org/10.1115/IMECE2022-96150

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Topics: Anodes, Lithium, Lithium-ion batteries, Silicon, Simulation, Stress, Algebra, Computation, Couplings, Differential equations

Proceedings Papers

Alignment of Nanomaterials in Hydrogels by Using Standing Surface Acoustic Wave-Enable

Jiali Li, Luyu Bo, Teng Li, Zhenhua Tian

Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A032, October 30–November 3, 2022

Paper No: IMECE2022-97095

DOI: https://doi.org/10.1115/IMECE2022-97095

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Topics: Acoustics, Hydrogels, Nanomaterials, Surface acoustic waves, Transducers, Waves, Multi-walled carbon nanotubes, Nanoparticles, Biomedicine, Electric potential

Proceedings Papers

Stereolithography Printing and Sintering of Silicon Carbide (SiC) Ceramics via Oxidation-Bonding

Padmalatha Kakanuru, Kishore Pochiraju

Proc. ASME. IMECE2022, Volume 2A: Advanced Manufacturing, V02AT02A023, October 30–November 3, 2022

Paper No: IMECE2022-96009

DOI: https://doi.org/10.1115/IMECE2022-96009

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Topics: Bonding, Ceramics, Oxidation, Printing, Silicon, Sintering, Stereolithography

Proceedings Papers

Effect of SF 6 and C 4 F 8 Flow Rate on Etched Surface Profile and Grass Formation in Deep Reactive Ion Etching Process

Pallavi Sharma, Matthias Pleil, Nathan Jackson

Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T13A012, October 30–November 3, 2022

Paper No: IMECE2022-92967

DOI: https://doi.org/10.1115/IMECE2022-92967

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Topics: Etching, Flow (Dynamics), Reactive-ion etching, Silicon, Cooling, Cycles, Corners (Structural elements), Energy dissipation, Gas flow, Heat

Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997

Paper No: IMECE1997-0819

DOI: https://doi.org/10.1115/IMECE1997-0819

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Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability

Proceedings Papers

Collision Behavior of a Water Droplet With a Hot Surface

Hitoshi Fujimoto, Natsuo Hatta, Hirohiko Takuda

Proc. ASME. IMECE97, Fluids Engineering, 167-172, November 16–21, 1997

Paper No: IMECE1997-0769

DOI: https://doi.org/10.1115/IMECE1997-0769

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Topics: Collisions (Physics), Drops, Water, Deformation, Temperature, Silicon, Stainless steel

Proceedings Papers

Experimental Investigation of Heat Transfer and Pressure Drop Through Deep Microchannels in a (110) Silicon Substrate

Todd M. Harms, Michael Kazmierczak, Frank M. Gerner, A. Hölke, H. T. Henderson, J. Pilchowski, Karl Baker

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 347-357, November 16–21, 1997

Paper No: IMECE1997-0860

DOI: https://doi.org/10.1115/IMECE1997-0860

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Topics: Heat transfer, Microchannels, Pressure drop, Silicon, Flow (Dynamics), Theoretical analysis, Chemical etching, Fluids, Forced convection, Reynolds number

Proceedings Papers

Optimization of the Silicon/PZT Longitudinal Mode Resonant Transducer

Amit Lai, Richard M. White

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 61-67, November 16–21, 1997

Paper No: IMECE1997-0940

DOI: https://doi.org/10.1115/IMECE1997-0940

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Topics: Optimization, Resonance, Silicon, Transducers, Laminates, Metals, Q-factor, Titanium alloys, Ultrasonic transducers

Proceedings Papers

Micromachined RF Signal Switching Devices on High Resistivity Silicon Substrates

Zhimin J. Yao, Chuck Goldsmith, Susan Eshelman, David Denniston

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 69-73, November 16–21, 1997

Paper No: IMECE1997-0941

DOI: https://doi.org/10.1115/IMECE1997-0941

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Topics: Cantilevers, Design, Electrical resistivity, Manufacturing, Membranes, Metals, Micromachining, Microwaves, Signals, Silicon

Proceedings Papers

High Resolution Single Crystal Silicon Accelerometer Using Silicon Fusion Bonding and Deep Reactive Ion Etching

B. P. van Drieënhuizen, N. I. Maluf

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 9-12, November 16–21, 1997

Paper No: IMECE1997-0931

DOI: https://doi.org/10.1115/IMECE1997-0931

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Topics: Accelerometers, Bonding, Crystals, Reactive-ion etching, Resolution (Optics), Silicon, Noise (Sound), Complementary metal oxide semiconductors, Brownian motion, Electronics

Proceedings Papers

A High-Sensitivity Micromachined Accelerometer Based on Electron Tunneling Transducers

C. H. Liu, J. K. Reynolds, A. Partridge, J. D. Grade, A. M. Barzilai, T. W. Kenny, H. K. Rockstad

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 13-20, November 16–21, 1997

Paper No: IMECE1997-0932

DOI: https://doi.org/10.1115/IMECE1997-0932

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Topics: Accelerometers, Electrons, Micromachining, Transducers, Tunnel construction, Resonance, Silicon, Acoustics, Design, Manufacturing

Proceedings Papers

Strength and Fracture of Micromachined Silicon Structures

Wan Suwito, Martin L. Dunn, Shawn J. Cunningham

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 99-104, November 16–21, 1997

Paper No: IMECE1997-0946

DOI: https://doi.org/10.1115/IMECE1997-0946

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Topics: Fracture (Materials), Fracture (Process), Micromachining, Silicon, Corners (Structural elements), Design, Anisotropy, Chemical etching, Crystals, Manufacturing

Proceedings Papers

A New Linear Stepper Motor Within a Hand Held Surgical Device

Raed N. Rizq, David R. Wulfman, David Peichel, Arthur G. Erdman, Dennis L. Polla

Proc. ASME. IMECE97, Advances in Bioengineering, 293-294, November 16–21, 1997

Paper No: IMECE1997-0344

DOI: https://doi.org/10.1115/IMECE1997-0344

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Topics: Stepper motors, Surgery, Instrumentation, Displacement, Silicon, Stress

Proceedings Papers

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Ji Li, Imin Kao, Vish Prasad

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 439-446, November 16–21, 1997

Paper No: IMECE1997-1121

DOI: https://doi.org/10.1115/IMECE1997-1121

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Topics: Modeling, Semiconductor wafers, Stress, Particulate matter, Wire, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries

Proceedings Papers

Machinability of Graphitic Silicon Carbide Aluminum Metal Matrix Composite GrA-Ni™

V. Songmene, T. F. Stephenson, A. E. M. Warner

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 193-200, November 16–21, 1997

Paper No: IMECE1997-1152

DOI: https://doi.org/10.1115/IMECE1997-1152

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Topics: Aluminum, Composite materials, Machinability, Silicon, Particulate matter, Graphite, Cutting, Metal matrix composites, Nickel, Cast iron

Proceedings Papers

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Jianjun Wang, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 411-421, November 16–21, 1997

Paper No: IMECE1997-1118

DOI: https://doi.org/10.1115/IMECE1997-1118

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Topics: Fracture toughness, Fracture (Materials), Temperature, Stress, Displacement, Finite element analysis, Interferometry, Molding, Silicon, Density

Proceedings Papers

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Y. Sungtaek Ju, Kenneth E. Goodson

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 181-190, November 16–21, 1997

Paper No: IMECE1997-0956

DOI: https://doi.org/10.1115/IMECE1997-0956

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Topics: Heat conduction, Phonons, Semiconductor films, Size effect, Thermal conductivity, Semiconductors (Materials), Silicon, Electromagnetic scattering, Radiation scattering, Scattering (Physics)

Proceedings Papers

Thermophotovoltaic Energy Conversion Technology Development at NASA Lewis Research Center

David M. Wilt, Donald L. Chubb

Proc. ASME. IMECE97, Advanced Energy Systems, 47-52, November 16–21, 1997

Paper No: IMECE1997-0972

DOI: https://doi.org/10.1115/IMECE1997-0972

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Topics: Energy conversion, NASA, Technology development, Emissions, Design, Photovoltaic cells, Power density, Silicon, Temperature, Aluminum

Proceedings Papers

150 Watt Portable Thermophotovoltaic Power Supply

Frederick E. Becker, Edward F. Doyle, Kailash C. Shukla

Proc. ASME. IMECE97, Advanced Energy Systems, 65-73, November 16–21, 1997

Paper No: IMECE1997-0975

DOI: https://doi.org/10.1115/IMECE1997-0975

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Topics: Ceramics, Defense industry, Design, Electricity (Physics), Energy conversion, Energy gap, Energy generation, Energy recovery, Engineering prototypes, Engines

NARROW

Potentials and Limitations of Concentrator Silicon Solar Cells Energy Utilization

A Computationally Efficient Approach for the Simulation of Silicon Anodes in Lithium-Ion Cells

Alignment of Nanomaterials in Hydrogels by Using Standing Surface Acoustic Wave-Enable

Stereolithography Printing and Sintering of Silicon Carbide (SiC) Ceramics via Oxidation-Bonding

Effect of SF 6 and C 4 F 8 Flow Rate on Etched Surface Profile and Grass Formation in Deep Reactive Ion Etching Process

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

Collision Behavior of a Water Droplet With a Hot Surface

Experimental Investigation of Heat Transfer and Pressure Drop Through Deep Microchannels in a (110) Silicon Substrate

Optimization of the Silicon/PZT Longitudinal Mode Resonant Transducer

Micromachined RF Signal Switching Devices on High Resistivity Silicon Substrates

High Resolution Single Crystal Silicon Accelerometer Using Silicon Fusion Bonding and Deep Reactive Ion Etching

A High-Sensitivity Micromachined Accelerometer Based on Electron Tunneling Transducers

Strength and Fracture of Micromachined Silicon Structures

A New Linear Stepper Motor Within a Hand Held Surgical Device

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Machinability of Graphitic Silicon Carbide Aluminum Metal Matrix Composite GrA-Ni™

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Thermophotovoltaic Energy Conversion Technology Development at NASA Lewis Research Center

150 Watt Portable Thermophotovoltaic Power Supply

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