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Proceedings Papers

A Robust Universal Controller

S. H. Lam

Proc. ASME. IMECE97, Dynamic Systems and Control, 571-577, November 16–21, 1997

Paper No: IMECE1997-0443

DOI: https://doi.org/10.1115/IMECE1997-0443

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Topics: Control equipment, Algebra, Computer software, Errors, Hardware, Sensors, Signal to noise ratio, Signals, Uncertainty

Proceedings Papers

Monitoring Technology for Achieving Intelligent Grinding System

Ichiro Inasaki

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 75-81, November 16–21, 1997

Paper No: IMECE1997-1078

DOI: https://doi.org/10.1115/IMECE1997-1078

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Topics: Grinding, Sensors, Wheels, Acoustic emissions, Monitoring systems, Abrasives, Artificial intelligence, Databases, Genetic algorithms, Reliability

Proceedings Papers

Online Estimation of Surface Roughness by Recurrent Fuzzy Inference in Grinding Process

Futoshi Kobayashi, Fumihito Arai, Toshio Fukuda, Makoto Onoda, Norimasa Marui

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 49-54, November 16–21, 1997

Paper No: IMECE1997-1074

DOI: https://doi.org/10.1115/IMECE1997-1074

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Topics: Grinding, Surface roughness, Manufacturing systems, Sensors, Shapes

Proceedings Papers

Discharge Quality Estimation and Significant Feature Identification in Micro-Electrical Discharge Machining

R. Ramabhadran, R. R. Hebbar, R. L. Kashyap, S. Chandrasekar

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 317-325, November 16–21, 1997

Paper No: IMECE1997-1106

DOI: https://doi.org/10.1115/IMECE1997-1106

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Topics: Electrical discharge machining, Machining, Sensors, Trains

Proceedings Papers

Open Architecture Modular Tool Kit for Motion and Machining Process Control

N. A. Erol, Y. Altintas

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 15-22, November 16–21, 1997

Paper No: IMECE1997-1070

DOI: https://doi.org/10.1115/IMECE1997-1070

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Topics: Computer numerical control machine tools, Machining, Process control, Robots, Computers, Lumber, Machine tools, Computer software, Control systems, Sensors

Proceedings Papers

Intelligent Process Monitoring for Rough Milling Operations Based on Digital Drive Currents and Machine Integrated Sensors

Michael Kaever, Manfred Weck

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 97-104, November 16–21, 1997

Paper No: IMECE1997-1081

DOI: https://doi.org/10.1115/IMECE1997-1081

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Topics: Currents, Machinery, Milling, Process monitoring, Sensors, Surface roughness

Proceedings Papers

Autonomous Calibration of Hexapod Machine Tools

Hanqi Zhuang, Lixin Liu, Oren Masory

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 443-449, November 16–21, 1997

Paper No: IMECE1997-1183

DOI: https://doi.org/10.1115/IMECE1997-1183

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Topics: Calibration, Machine tools, Machinery, Errors, Atlantic Ocean, Computer numerical control machine tools, Control equipment, Filters, Sensors

Proceedings Papers

Active Structural Control of Vertical Turning Lathe Vibrations

John E. Miesner, Reza Ghanadan, Stephen D. O’Regan

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 105-112, November 16–21, 1997

Paper No: IMECE1997-1082

DOI: https://doi.org/10.1115/IMECE1997-1082

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Topics: Turning, Vibration, Control equipment, Signals, Accelerometers, Actuators, Capacitors, Chatter, Control systems, Electronic components

Proceedings Papers

A New Electromagnetic Contact Sensing Technique for Enhancing Machining Accuracy

V. A. Ostafiev, Patri K. Venuvinod

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 113-119, November 16–21, 1997

Paper No: IMECE1997-1083

DOI: https://doi.org/10.1115/IMECE1997-1083

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Topics: Accuracy and precision, Coatings, Coordinate measuring machines, Cutting, Cutting tools, Design, Fluids, Geometry, Inspection, Machinery

Proceedings Papers

Development of a Magnetostrictive Torque Sensor for Milling Process Monitoring

Hiro Ohzeki, Akihiro Mashine, Hideki Aoyama, Ichiro Inasaki

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 129-136, November 16–21, 1997

Paper No: IMECE1997-1085

DOI: https://doi.org/10.1115/IMECE1997-1085

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Topics: Milling, Process monitoring, Sensors, Torque, Cutting, Alloys, Failure, Fracture (Materials), Fracture (Process), Permeability

Proceedings Papers

Application Specific Calibration of AE Sensors for Machining Monitoring

W. Hundt, C. Scheer

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 63-68, November 16–21, 1997

Paper No: IMECE1997-1076

DOI: https://doi.org/10.1115/IMECE1997-1076

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Topics: Calibration, Machining, Sensors, Signals, Acoustic emissions, Transfer functions

Proceedings Papers

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Tien-Yu Tom Lee, Ravi Sharma, André Peyre-Lavigne

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 339-345, November 16–21, 1997

Paper No: IMECE1997-1108

DOI: https://doi.org/10.1115/IMECE1997-1108

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Topics: Carbon monoxide, Computational fluid dynamics, Design, Sensors, Steady state, Transients (Dynamics), Cooling, Cycles, Electrical measurement, Energy consumption

Proceedings Papers

Prediction of Thermal Deformation of Machine Tool With Strain Sensor

Toshimichi Moriwaki, Eiji Shamoto, Masahiro Kawano

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 137-142, November 16–21, 1997

Paper No: IMECE1997-1086

DOI: https://doi.org/10.1115/IMECE1997-1086

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Topics: Machine tools, Strain sensors, Thermal deformation, Sensors, Deformation, Displacement, Machining centers, Strain gages, Strain measurement, Temperature distribution

Proceedings Papers

An Entropy-Based Index Evaluation Scheme for Multiple Sensor Fusion in Classification Process

Yubao Chen, Elsayed Orady

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 3-8, November 16–21, 1997

Paper No: IMECE1997-1068

DOI: https://doi.org/10.1115/IMECE1997-1068

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Topics: Entropy, Sensors, Decision making, Complex systems, Design, Feature extraction, Signals

Proceedings Papers

A Multi-Purpose Laser Sensor for Cutting Tools

Oleg Ryabov, Kazuo Mori, Nagayoshi Kasashima

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 9-14, November 16–21, 1997

Paper No: IMECE1997-1069

DOI: https://doi.org/10.1115/IMECE1997-1069

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Topics: Cutting tools, Lasers, Sensors, Milling, Displacement, Geometry, Chatter, Engineering prototypes, Failure, Laser beams

Proceedings Papers

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Yifan Guo, Vijay Sarihan, Tom Lee

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 23-27, November 16–21, 1997

Paper No: IMECE1997-1223

DOI: https://doi.org/10.1115/IMECE1997-1223

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Topics: Accelerated life testing, Membranes, Sensors, Reliability, Testing, Failure, High temperature, Stress, Cycles, Deformation

Proceedings Papers

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Y. Zou, J. C. Suhling, R. C. Jaeger, S. T. Lin, L. Nguyen, S. A. Gee

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 15-21, November 16–21, 1997

Paper No: IMECE1997-1222

DOI: https://doi.org/10.1115/IMECE1997-1222

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Topics: Silicon, Stress, Finite element analysis, Temperature, Constitutive equations, Electronic packaging, Engineering simulation, Packaging, Sensors, Shear stress

Proceedings Papers

Hydrostatic Response of Piezoresistive Stress Sensors

Y. Kang, A. K. M. Mian, J. C. Suhling, R. C. Jaeger

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 29-36, November 16–21, 1997

Paper No: IMECE1997-1224

DOI: https://doi.org/10.1115/IMECE1997-1224

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Topics: Hydrostatics, Sensors, Stress, Hydrostatic testing, Resistors, Calibration, Manufacturing, Pressure, Pressure vessels, Semiconductor wafers

Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997

Paper No: IMECE1997-1220

DOI: https://doi.org/10.1115/IMECE1997-1220

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Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors

Proceedings Papers

Evaluation of Die Stress Using van der Pauw Sensors

A. K. M. Mian, J. C. Suhling, R. C. Jaeger, B. M. Wilamowski

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 59-67, November 16–21, 1997

Paper No: IMECE1997-1228

DOI: https://doi.org/10.1115/IMECE1997-1228

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Topics: Sensors, Stress, Resistors, Silicon, Anisotropy, Electronic packaging, Heat conduction, Semiconductor wafers, Simulation results, Temperature

2 3 4 5

NARROW

A Robust Universal Controller

Monitoring Technology for Achieving Intelligent Grinding System

Online Estimation of Surface Roughness by Recurrent Fuzzy Inference in Grinding Process

Discharge Quality Estimation and Significant Feature Identification in Micro-Electrical Discharge Machining

Open Architecture Modular Tool Kit for Motion and Machining Process Control

Intelligent Process Monitoring for Rough Milling Operations Based on Digital Drive Currents and Machine Integrated Sensors

Autonomous Calibration of Hexapod Machine Tools

Active Structural Control of Vertical Turning Lathe Vibrations

A New Electromagnetic Contact Sensing Technique for Enhancing Machining Accuracy

Development of a Magnetostrictive Torque Sensor for Milling Process Monitoring

Application Specific Calibration of AE Sensors for Machining Monitoring

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Prediction of Thermal Deformation of Machine Tool With Strain Sensor

An Entropy-Based Index Evaluation Scheme for Multiple Sensor Fusion in Classification Process

A Multi-Purpose Laser Sensor for Cutting Tools

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Hydrostatic Response of Piezoresistive Stress Sensors

Advances in Stress Test Chips

Evaluation of Die Stress Using van der Pauw Sensors

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