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Proceedings Papers

Thermal Stresses in Unidirectional and Cross-Ply Composite Laminates: A 3-D Micromechanical Investigation

Brian E. Dix, Anil Saigal, Robert Greif
Proc. ASME. IMECE96, Aerospace, 435-444, November 17–22, 1996
Paper No: IMECE1996-0653
https://doi.org/10.1115/IMECE1996-0653
View Paper titled, Thermal Stresses in Unidirectional and Cross-Ply Composite Laminates: A 3-D Micromechanical Investigation
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Topics: Composite materials, Laminates, Thermal stresses, Stress, Temperature, Failure, Finite element model, Cracking (Materials), Epoxy adhesives, Epoxy resins
Proceedings Papers

Micro-Cavity Fiber Optic Sensors Embedded Into Laminated Composites for Impact and Impact-Induced Damage Detection

Chia-Chen Chang, Jim Sirkis
Proc. ASME. IMECE96, Aerospace, 655-662, November 17–22, 1996
Paper No: IMECE1996-0680
https://doi.org/10.1115/IMECE1996-0680
View Paper titled, Micro-Cavity Fiber Optic Sensors Embedded Into Laminated Composites for Impact and Impact-Induced Damage Detection
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Topics: Cavities, Composite materials, Damage, Fiber optic sensors, Sensors, Stress, Strain gages, X-rays, Aluminum plate, Copper
Proceedings Papers

Modeling the Effects of Translaminar Reinforcements on Mode II Fracture Toughness

V. Sonik, B. V. Sankar
Proc. ASME. IMECE96, Aerospace, 61-69, November 17–22, 1996
Paper No: IMECE1996-0610
https://doi.org/10.1115/IMECE1996-0610
View Paper titled, Modeling the Effects of Translaminar Reinforcements on Mode II Fracture Toughness
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Topics: Fracture toughness, Modeling, Crack propagation, Deflection, Fracture (Materials), Laminates, Springs, Stress, Bending (Stress), Composite materials
Proceedings Papers

A Summary of Darpa’s Embedded Sensors for Submarine Structures Program

John H. Belk, James J. Kelly, Roger M. Crane
Proc. ASME. IMECE96, Aerospace, 497-503, November 17–22, 1996
Paper No: IMECE1996-0661
https://doi.org/10.1115/IMECE1996-0661
View Paper titled, A Summary of Darpa’s Embedded Sensors for Submarine Structures Program
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Topics: Sensors, Underwater vehicles, Composite materials, Manufacturing, Defense industry, Design, Epoxy adhesives, Epoxy resins, Fiber optic sensors, Graphite
Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep

Anthony J. Rafanelli
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 45-58, November 17–22, 1996
Paper No: IMECE1996-0722
https://doi.org/10.1115/IMECE1996-0722
View Paper titled, A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep
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Topics: Creep, Epoxy adhesives, Epoxy resins, Reliability, Thermal stability, Thermomechanics, Solders, Adhesives, Bonding, Fatigue
Proceedings Papers

Finite Element Analysis of Optical Fiber Structures

B. R. Welker, M. Uschitsky, E. Suhir, S. Kher, G. Bubel
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 181-191, November 17–22, 1996
Paper No: IMECE1996-0733
https://doi.org/10.1115/IMECE1996-0733
View Paper titled, Finite Element Analysis of Optical Fiber Structures
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Topics: Finite element analysis, Optical fiber, Stress, Composite materials, Computer software, Design, Epoxy adhesives, Geometry, Metals, Modeling
Proceedings Papers

Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner

M. Uschitsky, E. Suhir
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 67-100, November 17–22, 1996
Paper No: IMECE1996-0724
https://doi.org/10.1115/IMECE1996-0724
View Paper titled, Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner
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Topics: Corners (Structural elements), Epoxy adhesives, Epoxy resins, Molding, Stress, Delamination, Adhesion, Fracture (Materials), Reliability, Design
Proceedings Papers

Damage Growth in Stitched Graphite/Epoxy Laminates Under Mode I Fracture and Compression Loading

Suresh K. Sharma, Bhavani V. Sankar
Proc. ASME. IMECE96, Aerospace, 39-50, November 17–22, 1996
Paper No: IMECE1996-0608
https://doi.org/10.1115/IMECE1996-0608
View Paper titled, Damage Growth in Stitched Graphite/Epoxy Laminates Under Mode I Fracture and Compression Loading
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Topics: Compression, Damage, Epoxy adhesives, Epoxy resins, Fracture (Materials), Graphite, Laminates, Textiles, Composite materials, Fracture toughness
Proceedings Papers

Three-Dimensional Penetration Modelling of Composite Plates

J. K. Chen, J. E. Beraun
Proc. ASME. IMECE96, Aerospace, 25-30, November 17–22, 1996
Paper No: IMECE1996-0606
https://doi.org/10.1115/IMECE1996-0606
View Paper titled, Three-Dimensional Penetration Modelling of Composite Plates
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Topics: Composite materials, Modeling, Plates (structures), Damage, Engineering simulation, Epoxy adhesives, Epoxy resins, Fiber reinforced composites, Fibers, Graphite
Proceedings Papers

Active Fracture Control of a Composite Material System With SMA Actuator and AE Sensor

Y. Furuya, A. Shimamoto, J. Tani, J. Qiu
Proc. ASME. IMECE96, Aerospace, 529-533, November 17–22, 1996
Paper No: IMECE1996-0666
https://doi.org/10.1115/IMECE1996-0666
View Paper titled, Active Fracture Control of a Composite Material System With SMA Actuator and AE Sensor
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Topics: Actuators, Composite materials, Fracture (Materials), Sensors, Fibers, Epoxy adhesives, Epoxy resins, Failure, Shapes, Acoustic emissions
Proceedings Papers

Damage in Unidirectional Graphite/Epoxy Laminates Containing a Circular Hole

Fan Yang, C. L. Chow, H. Eliot Fang
Proc. ASME. IMECE96, Aerospace, 805-813, November 17–22, 1996
Paper No: IMECE1996-0697
https://doi.org/10.1115/IMECE1996-0697
View Paper titled, Damage in Unidirectional Graphite/Epoxy Laminates Containing a Circular Hole
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Topics: Damage, Epoxy adhesives, Epoxy resins, Graphite, Laminates, Composite materials, Failure, Fibers, Constitutive equations, Damage mechanics
Proceedings Papers

Finite Element Analysis of a Biaxially Loaded Woven Fabric Composite Laminate With a Central Hole

Ajit D. Kelkar, Pramod Chaphalkar, J. Sankar
Proc. ASME. IMECE96, Recent Advances in Solids/Structures and Application of Metallic Materials, 27-34, November 17–22, 1996
Paper No: IMECE1996-0141
https://doi.org/10.1115/IMECE1996-0141
View Paper titled, Finite Element Analysis of a Biaxially Loaded Woven Fabric Composite Laminate With a Central Hole
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Topics: Composite materials, Finite element analysis, Laminates, Textiles, Fibers, Stress concentration, Design, Epoxy adhesives, Epoxy resins, Finite element model
Proceedings Papers

Microelectronic Chip Attach With Silver Filled Epoxies: An Analytical and Experimental Study

K. J. Zwick, P. S. Ayyaswamy, I. M. Cohen
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 121-127, November 17–22, 1996
Paper No: IMECE1996-1037
https://doi.org/10.1115/IMECE1996-1037
View Paper titled, Microelectronic Chip Attach With Silver Filled Epoxies: An Analytical and Experimental Study
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Topics: Epoxy adhesives, Epoxy resins, Silver, Bonding, Flow (Dynamics)
Proceedings Papers

An Analytical Study of Investment Casting With Webbed Epoxy Patterns

W. L. Yao, H. Wong, M. C. Leu, D. H. Sebastian
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 11-15, November 17–22, 1996
Paper No: IMECE1996-0770
https://doi.org/10.1115/IMECE1996-0770
View Paper titled, An Analytical Study of Investment Casting With Webbed Epoxy Patterns
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Topics: Epoxy adhesives, Epoxy resins, Investment casting (Process), Investment castings, Finite element analysis, Geometry, Stress, Thermal expansion, Buckling, Ceramics
Proceedings Papers

Viscoelastic Analysis of IC Package Warpage

T. S. Yeung, M. M. F. Yuen
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 101-107, November 17–22, 1996
Paper No: IMECE1996-0896
https://doi.org/10.1115/IMECE1996-0896
View Paper titled, Viscoelastic Analysis of IC Package Warpage
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Topics: Warping, Coordinate measuring machines, Finite element analysis, Mechanical properties, Temperature, Epoxy adhesives, Epoxy resins, Finite element model, Glass transition, Hardening (Curing)
Proceedings Papers

Curing Analysis of a Flip-Chip-on-Board Electronic Package

Wen C. Zheng
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 13-22, November 17–22, 1996
Paper No: IMECE1996-0885
https://doi.org/10.1115/IMECE1996-0885
View Paper titled, Curing Analysis of a Flip-Chip-on-Board Electronic Package
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Topics: Electronic packages, Hardening (Curing), Epoxy adhesives, Epoxy resins, Manufacturing, Finite element methods, Finite element model, Temperature, Chemical reactions, Computer simulation
Proceedings Papers

The Effects of Hail Damage on the Fatigue Strength of a Graphite/Epoxy Composite Laminate

Richard A. Skordahl, Mohammad Mahinfalah
Proc. ASME. IMECE96, Aerospace and Materials, 365-372, November 17–22, 1996
Paper No: IMECE1996-0491
https://doi.org/10.1115/IMECE1996-0491
View Paper titled, The Effects of Hail Damage on the Fatigue Strength of a Graphite/Epoxy Composite Laminate
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Topics: Composite materials, Damage, Epoxy adhesives, Epoxy resins, Fatigue strength, Graphite, Laminates, Aluminum, Fatigue, Kinetic energy
Proceedings Papers

Effects of High Heat on the Strength and Fatigue Life of Unidirectional Polymer-Matrix Composites

Philip V. D. McLaughlin, Jr., Henry A. McShane, Roland Cochran, Eileen Armstrong-Carroll
Proc. ASME. IMECE96, Aerospace and Materials, 427-441, November 17–22, 1996
Paper No: IMECE1996-0495
https://doi.org/10.1115/IMECE1996-0495
View Paper titled, Effects of High Heat on the Strength and Fatigue Life of Unidirectional Polymer-Matrix Composites
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Topics: Composite materials, Fatigue life, Heat, Polymers, Temperature, Epoxy adhesives, Epoxy resins, Damage, Fibers, Graphite
Proceedings Papers

Determination of Interfacial Fracture Toughness in High Temperature Composites

V. Bechel, N. R. Sottos
Proc. ASME. IMECE96, Aerospace and Materials, 155-165, November 17–22, 1996
Paper No: IMECE1996-0475
https://doi.org/10.1115/IMECE1996-0475
View Paper titled, Determination of Interfacial Fracture Toughness in High Temperature Composites
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Topics: Composite materials, Fracture toughness, High temperature, Fibers, Temperature, Epoxy adhesives, Epoxy resins, Polyester fabrics, Stress, Shear (Mechanics)
Proceedings Papers

Concurrently Engineered Active Composite Sandwich Panels

K. L. Koudela, G. H. Koopmann, W. Chen
Proc. ASME. IMECE96, Noise Control and Acoustics: Volume 1 — Active Noise and Vibration Control; Complexity in Acoustics; Noise Sources in Internal Combustion Engines; Vehicle Flow/Structure Noises; Aeroacoustic Sound Propagation in Ducts and Jets; Turbomachinery Noise; BS/MS Student Paper Competition, 275-280, November 17–22, 1996
Paper No: IMECE1996-0534
https://doi.org/10.1115/IMECE1996-0534
View Paper titled, Concurrently Engineered Active Composite Sandwich Panels
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Topics: Composite materials, Sandwich panels, Actuators, Engineering prototypes, Sound pressure, Design, Dynamic response, Electromagnetic spectrum, Epoxy adhesives, Epoxy resins