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Proceedings Papers

Design of Servo Code and Synchronous Clock Writing Scheme on a High Capacity Disk Drive

Jingli Zhou, Sheng Sheng Yu, Joseph T. Ma

Proc. ASME. IMECE97, 8th International Symposium on Information Storage and Processing Systems, 61-67, November 16–21, 1997

Paper No: IMECE1997-0582

DOI: https://doi.org/10.1115/IMECE1997-0582

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Topics: Clocks, Design, Disks, Servomechanisms, Encryption, Mathematical analysis

Proceedings Papers

Quantum CFD Simulations for Heat Transfer Applications

Chao Lu, Zhao Hu, Bei Xie, Ning Zhang

Proc. ASME. IMECE2020, Volume 10: Fluids Engineering, V010T10A050, November 16–19, 2020

Paper No: IMECE2020-23915

DOI: https://doi.org/10.1115/IMECE2020-23915

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Topics: Computational fluid dynamics, Engineering simulation, Heat transfer, Simulation, Linear systems, Quality control, Algorithms, Eigenvalues, Circuits, Clocks

Proceedings Papers

Functional Models With Inherent Behavior: Towards a Framework for Safety Analysis Early in the Design of Complex Systems

Matthew G. McIntire, Elham Keshavarzi, Irem Y. Tumer, Christopher Hoyle

Proc. ASME. IMECE2016, Volume 11: Systems, Design, and Complexity, V011T15A035, November 11–17, 2016

Paper No: IMECE2016-67040

DOI: https://doi.org/10.1115/IMECE2016-67040

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Topics: Complex systems, Design, Safety, Failure, Flow (Dynamics), Machinery, Delays, Modeling, Architecture, Clocks

Proceedings Papers

Enabling Right-Provisioned Microprocessor Architectures for the Internet of Things

Tosiron Adegbija, Anita Rogacs, Chandrakant Patel, Ann Gordon-Ross

Proc. ASME. IMECE2015, Volume 14: Emerging Technologies; Safety Engineering and Risk Analysis; Materials: Genetics to Structures, V014T06A001, November 13–19, 2015

Paper No: IMECE2015-50173

DOI: https://doi.org/10.1115/IMECE2015-50173

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Topics: Architecture, Internet of things, Computation, Clocks, Design, Embedded systems, Energy consumption, Explosions, Leakage

Proceedings Papers

Investigation of Thermoelastic Loss Mechanism in Shell Resonators

Ali Darvishian, Behrouz Shiari, Jae Yoong Cho, Tal Nagourney, Khalil Najafi

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A062, November 14–20, 2014

Paper No: IMECE2014-39331

DOI: https://doi.org/10.1115/IMECE2014-39331

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Topics: Shells, Thermoelasticity, Energy dissipation, Conductive coatings, Clocks, Computer simulation, Damping, Design, Filters, Materials properties

Proceedings Papers

Elastic Beam Vibration Control With Phase-Locked Loop

Guilherme Cano Lopes, Átila Madureira Bueno, José Manoel Balthazar

Proc. ASME. IMECE2014, Volume 4B: Dynamics, Vibration, and Control, V04BT04A026, November 14–20, 2014

Paper No: IMECE2014-36647

DOI: https://doi.org/10.1115/IMECE2014-36647

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Topics: Vibration control, Control systems, Signals, Atomic force microscopy, Bifurcation, Chaos, Clocks, Computation, Engines, Flow (Dynamics)

Proceedings Papers

A Rotary-Leg Robot Model That Predicts Both Leg Revolution and Oscillation Behavior

Xiaoxiao Lu, Justin Seipel

Proc. ASME. IMECE2011, Volume 7: Dynamic Systems and Control; Mechatronics and Intelligent Machines, Parts A and B, 295-300, November 11–17, 2011

Paper No: IMECE2011-65649

DOI: https://doi.org/10.1115/IMECE2011-65649

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Topics: Oscillations, Robots, Stability, Center of mass, Clocks, Dynamics (Mechanics), Path planning, Pendulums, Springs

Proceedings Papers

A Spring-Mass Model of Locomotion With Full Asymptotic Stability

Zhuohua Shen, Justin Seipel

Proc. ASME. IMECE2011, Volume 7: Dynamic Systems and Control; Mechatronics and Intelligent Machines, Parts A and B, 301-306, November 11–17, 2011

Paper No: IMECE2011-65652

DOI: https://doi.org/10.1115/IMECE2011-65652

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Topics: Springs, Stability, Pendulums, Center of mass, Clocks, Dynamics (Mechanics), Energy conservation, Legged locomotion

Proceedings Papers

Relay Feedback Oscillator Design for Modeling Circadian Rhythms in Cyanobacteria

Jaromir Fiser, Pavel Zitek, Jan Cerveny

Proc. ASME. IMECE2011, Volume 2: Biomedical and Biotechnology Engineering; Nanoengineering for Medicine and Biology, 549-556, November 11–17, 2011

Paper No: IMECE2011-64996

DOI: https://doi.org/10.1115/IMECE2011-64996

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Topics: Design, Feedback, Modeling, Low-pass filters, Poles (Building), Stability, Clocks, Filters, Limit cycles, Oscillations

Proceedings Papers

Effect of Relocation of Functional Units of a Non-Uniformly Powered Microprocessor on Thermal and Device Clock Performance

Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmad

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 179-184, November 13–19, 2009

Paper No: IMECE2009-11769

DOI: https://doi.org/10.1115/IMECE2009-11769

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Topics: Clocks, Temperature, Computers, Junctions, Control equipment, Numerical analysis, Pareto optimization, Product reliability, Temperature gradient

Proceedings Papers

A Proposed Lexicon for Class Definition in a Product Lifecycle Model

Lowell E. Lingo, Jr., Utpal Roy

Proc. ASME. IMECE2007, Volume 3: Design and Manufacturing, 149-157, November 11–15, 2007

Paper No: IMECE2007-42285

DOI: https://doi.org/10.1115/IMECE2007-42285

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Topics: Ambiguity, Clocks, Conceptual design, Design, Information models, Modeling, Pendulums, Product design, Service life (Equipment)

Proceedings Papers

Physical-Based Simulations of Mechanical Watches and Clocks

L. C. Tam, Tom Kong, R. Du

Proc. ASME. IMECE2007, Volume 12: New Developments in Simulation Methods and Software for Engineering Applications, 123-128, November 11–15, 2007

Paper No: IMECE2007-41771

DOI: https://doi.org/10.1115/IMECE2007-41771

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Topics: Clocks, Simulation, Computer software, Dynamics (Mechanics), Gear trains, Levers, Modeling, Oscillations, Pallets, Simulation models

Proceedings Papers

A Study of Transient Thermal Spreading of VLSI Packaging With Multi Level Scaling

Kazuaki Yazawa, Tenko Yamashita, Hideaki Kuroda

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 67-73, November 11–15, 2007

Paper No: IMECE2007-41658

DOI: https://doi.org/10.1115/IMECE2007-41658

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Topics: Packaging, Transients (Dynamics), Energy consumption, Cascades (Fluid dynamics), Clocks, Dimensions, Heat, Heat flux, Heat sinks, Modeling

Proceedings Papers

Opto-Microactuator With Low-Thermal-Conductivity Material by Laser Heating

Masahiro Ota, Atsunobu Noguchi

Proc. ASME. IMECE2002, Heat Transfer, Volume 1, 271-276, November 17–22, 2002

Paper No: IMECE2002-32439

DOI: https://doi.org/10.1115/IMECE2002-32439

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Topics: Heating, Lasers, Microactuators, Thermal conductivity, Actuators, Blades, Glass, Borosilicate glasses, Aluminum, Gasdynamics

Proceedings Papers

The Original “Silken Valley”: How and Why the Derwent Valley Became the Birthplace of the Industrial Revolution

John G. Crofts

Proc. ASME. IMECE2002, Technology and Society and Engineering Business Management, 15, November 17–22, 2002

Paper No: IMECE2002-33134

DOI: https://doi.org/10.1115/IMECE2002-33134

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Topics: Clocks, Engineering prototypes, Flow (Dynamics), Hydropower, Iron, Porcelain, Pumps, Renewable energy sources, Rivers, Textile factories

Proceedings Papers

On the Dynamic Short-Time Scale Wave Propagation and the Characterization of Optimal Packaging Material for High Performance Electronic Packages

Yoonchan Oh, C. Steve Suh, H.-J. Sue

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 269-276, November 17–22, 2002

Paper No: IMECE2002-39669

DOI: https://doi.org/10.1115/IMECE2002-39669

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Topics: Electronic packages, Packaging, Wave propagation, Transients (Dynamics), Reliability, Waves, Clocks, Cracking (Materials), Delamination, Density

Proceedings Papers

Singulation of Electronic Packages With Abrasive Waterjets

Mohamed Hashish

Proc. ASME. IMECE2005, Manufacturing Engineering and Materials Handling, Parts A and B, 853-861, November 5–11, 2005

Paper No: IMECE2005-79659

DOI: https://doi.org/10.1115/IMECE2005-79659

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Topics: Accuracy and precision, Clocks, Cutting, Delamination, Drilling, Electronic packages, Geometry, Machinery, Reliability, Storage

Proceedings Papers

Approximate Analytical Model for a First Level Package With Non-Uniformly Powered Die

Abhijit Kaisare, Dereje Agonafer, A. Haji-Sheikh, Greg Chrysler, Ravi Mahajan

Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 43-49, November 5–10, 2006

Paper No: IMECE2006-13436

DOI: https://doi.org/10.1115/IMECE2006-13436

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Topics: Clocks, Computer simulation, Design, Finite element analysis, Flat heat pipes, Heat flux, Heat sinks, Junctions, Temperature, Temperature distribution

Proceedings Papers

Thermal Conduction Switch for Thermal Management of Chip Scale Atomic Clocks

A. D. Laws, Y. J. Chang, V. M. Bright, Y. C. Lee

Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 29-34, November 5–10, 2006

Paper No: IMECE2006-14540

DOI: https://doi.org/10.1115/IMECE2006-14540

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Topics: Atomic clocks, Heat conduction, Switches, Thermal management, Resistors, Temperature, Thermal resistance, Disks, Finite element analysis, Vacuum

NARROW

Design of Servo Code and Synchronous Clock Writing Scheme on a High Capacity Disk Drive

Quantum CFD Simulations for Heat Transfer Applications

Functional Models With Inherent Behavior: Towards a Framework for Safety Analysis Early in the Design of Complex Systems

Enabling Right-Provisioned Microprocessor Architectures for the Internet of Things

Investigation of Thermoelastic Loss Mechanism in Shell Resonators

Elastic Beam Vibration Control With Phase-Locked Loop

A Rotary-Leg Robot Model That Predicts Both Leg Revolution and Oscillation Behavior

A Spring-Mass Model of Locomotion With Full Asymptotic Stability

Relay Feedback Oscillator Design for Modeling Circadian Rhythms in Cyanobacteria

Effect of Relocation of Functional Units of a Non-Uniformly Powered Microprocessor on Thermal and Device Clock Performance

A Proposed Lexicon for Class Definition in a Product Lifecycle Model

Physical-Based Simulations of Mechanical Watches and Clocks

A Study of Transient Thermal Spreading of VLSI Packaging With Multi Level Scaling

Opto-Microactuator With Low-Thermal-Conductivity Material by Laser Heating

The Original “Silken Valley”: How and Why the Derwent Valley Became the Birthplace of the Industrial Revolution

On the Dynamic Short-Time Scale Wave Propagation and the Characterization of Optimal Packaging Material for High Performance Electronic Packages

Singulation of Electronic Packages With Abrasive Waterjets

Approximate Analytical Model for a First Level Package With Non-Uniformly Powered Die

Thermal Conduction Switch for Thermal Management of Chip Scale Atomic Clocks

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